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The copper backplane inside a rack is the new advanced packaging, and scaling it is where the next generation of performance comes from.

Drawn from what Doug O'Laughlin said

What Doug O'Laughlin actually said

  1. Doug O'Laughlin Semiconductor analyst, author of the Fabricated Knowledge…
    The copper backplane in the data center rack is effectively the new advanced packaging in the system-level Moore’s Law race.

Added to korrents 7 Sept 2026 · How quotes work · Something wrong? Tell us

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