korrents

korrents · piece

How to Build a $20 Billion Semiconductor Fab

Brian Potter · 3 May 2024 · construction-physics.com

7 korrents from this piece

Brian Potter did not write this page.

Every claim below was made in this piece, quoted word for word and numbered in the order the piece makes them, so you can read it there rather than take our word for it. The sentence above each quote is our reading of the claim, not their wording. Each quote was checked against a stored copy of the page at build time; where the two differ, the quote is the fact.

  1. These enormous costs are ultimately due to the same factor that has steadily driven down the cost of semiconductors: Moore’s Law, the observation that the number of components on an integrated circuit tends to double every two years.
  2. Fab construction time in the US has increased from just over 650 days on average in the 1990s to over 900 days on average in the 2010s, compared to around 600-700 days in Asian countries, in part because of increasingly stringent environmental review processes.
  3. Roughly 70-80% of the cost of a new fab will be the process tools that go in it.
  4. The cost of lithography machines is often estimated as 20% of the cost of a new fab, which means that lithography tools can cost as much as the entire fab facility itself.
  5. For modern semiconductor fabs, each new process node increases fab cost by about 30%.
  6. But as fab costs increased, it became more and more burdensome for manufacturers to operate cutting edge manufacturing facilities due to the high costs, and fewer manufacturers had the production volume to spread those costs over.
  7. The second is that producing semiconductors requires almost unfathomable levels of precision.